ITEM

Standard (mm)

Advanced (mm)

(A) Via diameter

0.125, 0.180^【1】

Flexible  (Min. 0.06)

(B) Min. via cover pad

Via ¯. + 0.03

Via ¯. + 0.02

(C) Min. via diameter / pitch  (Flip chip)

0.125/ 0.260

0.060 / 0.180

(D) Min. spacing from via cover pad to line

0.10

0.08

(E) Min Line width

Nominal

0.10

0.05

Mean value tolerance

±  0.015

±  0.010

(F) Min. line spacing

0.10

0.08

(G) Min. spacing from via cover pad to substrate edge

0.15

0.10

(H) Min. spacing from conductor to substrate edge

0.15

0.10

(I) Min. dimension for extended terminal

0.10

0.08

(M) Min. spacing from ground plane to substrate edge

0.15

0.10

(N) Feed thru spacing

0.15

0.10

Conductor thickness

Nominal

0.013

0.010 (Fine-line printing)

Tolerance

±  0.003

±  0.002

Tape thickness

Without stacked conductors

0.024

0.035

0.046

0.052

Flexible^【3】

(Min/Max: 0.015/0.133)

0.094

0.104

0.129

0.147

With stacked conductors^【2】

0.020

0.030

0.040

0.045

0.080

0.090

0.115

0.133

Tolerance^【3】

Thickness ³0.090

± 7 %

± 5 %

Thickness £0.080

± 5%

± 3 % (Min. ±0.002)

Substrate thickness

Max.

1.6

2.4

Min.

0.5

0.3

Tolerance

±7%(min± 0.075)

±5%(min ± 0.050)

Camber

< 0.3%

< 0.2%

Number of layers

Up to 20

Up to 30

Layer to layer alignment tolerance

± 0.050

± 0.025

Max. panel & array size

Max.

57 x 53

114 x 106

Tolerance

±0.5%（Min. ±0.200）

±0.2%（Min. ±0.100）