| High Frequency Multilayer Chip Inductors |
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| HI 0402
Series |
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| Features |
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Super fine and monolithic structure ensuring high performance and
reliability.
High frequency applications up to 6GHz.
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| Applications |
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RF modules for
telecommunication systems including GSM, PCS, DECT, WLAN, Bluetooth, etc. |
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| Shape and
Dimensions |
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Unit : mm (inch)
| TYPE |
EIA Code |
A |
B |
C |
D |
0402 |
01005 |
0.40+/-
0.03 |
0.20+/-
0.03 |
0.20+/-
0.03 |
0.10+/-
0.05 |
(0.016+/-0.001) |
(0.008+/-0.001) |
(0.008+/-0.001) |
(0.004+/-0.002) |
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| Specifications |
| Part Number |
Inductance
(nH) |
Q
Min. |
Q
Typ. |
L/Q
Freq.
(MHz) |
Q Typical (MHz) |
RDC
(W) Max. |
S.R.F.
(MHz)
Typ. |
IDC
(mA)
Max. |
| 500 |
800 |
1800 |
Max. |
Typ. |
HI0402-1C0N8_N_ |
0.8 กำ 0.3 |
2 |
3 |
100 |
9 |
10 |
5 |
0.2 |
0.15 |
>13500 |
200 |
HI0402-1C1N0_N_ |
1.0 กำ 0.3 |
2 |
3 |
100 |
9 |
10 |
5 |
0.2 |
0.15 |
>13500 |
200 |
HI0402-1C1N2_N_ |
1.2 กำ 0.3 |
2 |
3 |
100 |
9 |
10 |
5 |
0.22 |
0.15 |
>13500 |
200 |
HI0402-1C1N5_N_ |
1.5 กำ 0.3 |
2 |
3 |
100 |
9 |
10 |
5 |
0.24 |
0.19 |
>13500 |
200 |
HI0402-1C1N8_N_ |
1.8 กำ 0.3 |
2 |
3 |
100 |
9 |
10 |
5 |
0.3 |
0.2 |
>13500 |
200 |
HI0402-1C2N2_N_ |
2.2 กำ 0.3 |
2 |
3 |
100 |
9 |
10 |
5 |
0.44 |
0.26 |
12300 |
200 |
HI0402-1C2N7_N_ |
2.7 กำ 0.3 |
2 |
3 |
100 |
9 |
10 |
5 |
0.5 |
0.33 |
11700 |
200 |
HI0402-1C3N3_N_ |
3.3 กำ 0.3
or กำ 10% |
2 |
3 |
100 |
9 |
10 |
5 |
0.55 |
0.36 |
9800 |
200 |
HI0402-1C3N9_N_ |
3.9 กำ 0.3
or กำ 10% |
2 |
3 |
100 |
9 |
10 |
5 |
0.6 |
0.41 |
8200 |
200 |
HI0402
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| Reliability / Testing / Packaging |
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| Notes |
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The contents of this data sheet are subject
to change without notice. Please confirm the
specifications and delivery conditions when
placing your order. |
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| TOP |
| Copyright©2002 ACX Corp. All Rights
Reserved |
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